Fused Silica

OHARA synthetic fused silica is produced by vapor-phase axial deposition and provides ultra-pure, bubble free material.

Method	Material	Characteristics	Application	Standard size
Fused Silica	SK-1300 Series SK-1300 SK-1310 SK-1320	The VAD method developed for optical fiber has been further improved to manufacture fused silica. Unparalleled, ideal characteristics are achieved. Ultra-high purity (total metallic impurities less than 0.5ppm) The OH content can be controlled to 1 ppm or less. High heat resistance is ensured. High transmission is achieved. (The SK-1310 has excellent characteristics over the entire wavelength range of ultraviolet, visible, and infrared.) Contains no bubbles or striae. Excellent laser resistance properties	Wafers for various types of devices such as TFT (poly-si thin-film transistor LCD), SOI (Silicon on Insulator) etc. Photomask substrates for ultra-LSI and LCD. Optical elements, lenses, mirrors and windows for ultraviolet and vacuum ultraviolet.	[Plates] 50~ 500mm round 50~ 1000mm square