Fused Silica

OHARA synthetic fused silica is produced by vapor-phase axial deposition and provides ultra-pure, bubble free material. 

Fused Silica

Method Material Characteristics Application Standard size
Fused Silica SK-1300 Series
SK-1300
SK-1310
SK-1320
  • The VAD method developed for optical
    fiber has been further improved to manufacture fused silica.
  • Unparalleled, ideal characteristics are achieved.
    • Ultra-high purity (total metallic
      impurities less than 0.5ppm)
    • The OH content can be controlled to 1 ppm or less.
    • High heat resistance is ensured.
    • High transmission is achieved.
      (The SK-1310 has excellent
      characteristics
      over the entire wavelength range of
      ultraviolet, visible, and infrared.)
    • Contains no bubbles or striae.
    • Excellent laser resistance properties
  • Wafers for various types of devices
    such as TFT (poly-si thin-film transistor LCD),
    SOI (Silicon on Insulator) etc.
  • Photomask substrates for ultra-LSI and LCD.
  • Optical elements, lenses,
    mirrors and windows for ultraviolet
    and vacuum ultraviolet.
[Plates]
  • 50~ 500mm round
  • 50~ 1000mm square