Fused Silica

● The VAD method developed for optical fiber has been further improved to manufacture fused silica.

● Unparalleled, ideal characteristics are achieved. Ultra-high purity (total metallic impurities less than 0.5ppm)

● The OH content can be controlled to 1 ppm or less.

● High heat resistance is ensured.

● High transmission is achieved. (The SK-1310 has excellent characteristics over the entire wavelength range of ultraviolet, visible, and infrared.)

● Contains no bubbles or striae.

● Excellent laser resistance properties

● Wafers for various types of devices such as TFT (poly-si thin-film transistor LCD), SOI (Silicon on Insulator) etc.

● Photomask substrates for ultra-LSI and LCD.

● Optical elements, lenses, mirrors and windows for ultraviolet and vacuum ultraviolet.